Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging

ID: 4962

Type: Full-time

Category: Others

Company Name: Annapurna Labs (U.S.) Inc.

Location: USA, TX, Austin; USA, CA, Cupertino - Cupertino - United States

Salary: 183,000.00 - 247,600.00 USD annually

Job Description

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

We are seeking a Sr. Package Layout Engineer to lead the end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs.

In this role, you will own the package layout from initial floor planning through tape out and manufacturing release. You'll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.

Key job responsibilities
- Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release.
- Drive physical design of advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Define and optimize package floorplans considering die placement, bump maps, power/ground distribution, high-speed signal escape routing, and decoupling capacitor placement.
- Perform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers.
- Participate in die-level RDL routing and bump planning in coordination with ASIC physical design teams, ensuring the die-package interface is co-optimized for power delivery and signal routing from the earliest design stages.
- Drive cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels to achieve the best overall power delivery network and high-speed signaling performance, minimizing impedance discontinuities and routing bottlenecks at each interface boundary.
- Develop and maintain package stack-up definitions in collaboration with SI/PI and materials engineering teams, ensuring impedance targets, layer utilization, and manufacturing constraints are met.
- Create and enforce package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance and high yield.
- Run and review physical verification checks (DRC, connectivity, shorts/opens) and drive design closure with zero escapes.
- Manage package design schedules, milestones, and deliverables, coordinating across multiple concurrent projects and tape out cycles.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout — impedance-controlled routing, power plane optimization, and critical net shielding.
- Interface with OSAT vendors and foundry partners on substrate and interposer manufacturing feasibility, design rule negotiations, and process capability alignment.
- Identify packaging technology risks early and propose design or process mitigations to ensure reliability and manufacturability.
- Mentor junior layout engineers and contribute to the development of team best practices, automation flows, and design reuse strategies.

About the team
Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and we’re building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.

Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.

About AWS
Amazon Web Services (AWS) is the world’s most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating — that’s why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.

Inclusive Team Culture
Here at AWS, it’s in our nature to learn and be curious. Our employee-led affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences, including our Conversations on Race and Ethnicity (CORE) and AmazeCon (gender diversity) conferences, inspire us to never stop embracing our uniqueness.

Work/Life Balance
We value work-life harmony. Achieving success at work should never come at the expense of sacrifices at home, which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home, there’s nothing we can’t achieve in the cloud.

Mentorship & Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.

Basic Qualifications

- Bachelor's degree in electrical engineering, material engineering, mechanical engineering or related fields
- 10+ years of experience in IC package layout and physical design
- Proven track record of leading package designs from concept through tape out for complex, multi-layer organic substrates or silicon interposers
- Hands-on expertise with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
- Deep understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, and silicon bridge interconnects
- Strong knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks)
- Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design for high pin-count packages
- Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions

Preferred Qualifications

- Master's degree or equivalent in mechanical engineering, electrical engineering, material science, physics or equivalent
- 7+ years, in IC package layout and physical design
- Experience with chiplet-based or heterogeneous integration packaging architectures
- Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate effectively with SI/PI engineers
- Experience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks, design rule checks, or data exchange workflows
- Hands-on experience working directly with OSAT partners on NPI (new product introduction) builds and yield improvement
- Knowledge of package-level thermal design considerations and their impact on layout decisions (hot spot management, thermal via placement).
- Experience with high-bandwidth memory (HBM) integration in advanced packaging contexts.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, CA, Cupertino - 183,000.00 - 247,600.00 USD annually
USA, TX, Austin - 159,200.00 - 215,300.00 USD annually

Company Information

Company Name: Annapurna Labs (U.S.) Inc.

Company Website: https://annapurna-labs.com

Company Address: 10201 Torre Avenue, Cupertino, California 95014, USA

Annapurna Labs (U.S.) Inc. is the U.S. corporate entity of Annapurna Labs, an engineering organization originally founded as a semiconductor and systems-on-chip (SoC) design company that was acquired by Amazon in 2015 and subsequently integrated into Amazon Web Services (AWS). The business is organized around the design and delivery of custom silicon, hardware acceleration engines, and tightly integrated hardware–software platforms used to improve performance, security, and efficiency of cloud infrastructure. Annapurna Labs operates as an engineering and product-development organization whose principal output is purpose-built silicon, firmware, and supporting software stacks that are deployed inside AWS data centers and products. Company overview: Annapurna Labs began as a privately held microelectronics and chip-design startup with an emphasis on low-power, high-density compute and specialized accelerators. After acquisition by Amazon, the group continued as an internal Amazon/AWS engineering organization, focused on developing devices and subsystems that address bottlenecks in cloud servers and networking equipment. The organization is widely credited in official Amazon/AWS materials and public communications with designing and delivering several generations of custom AWS silicon and the enabling hardware subsystems that underpin notable AWS services and instance families. Core business activities: Annapurna Labs’ core activities center on end-to-end silicon and platform engineering: architecture, RTL and logic design, physical implementation, verification, firmware, board design, and the software integration required to bring custom chips into production at hyperscale. Key technical specializations include SoC and CPU core design, network and storage offload engines, hardware virtualization and security enclaves, high-speed interconnects, and low-level system software to exploit hardware capabilities. Instead of operating as a customer-facing chip vendor, the organization’s outputs are integrated into AWS infrastructure and services—its primary “customers” are AWS teams and the cloud customers that rely on AWS services. Main products and services: Public and official AWS communications associate Annapurna Labs with multiple internal silicon and platform programs that have been announced or described by Amazon. Notable outcomes attributable to the group include the AWS Nitro System, a collection of dedicated hardware and firmware components that offload virtualization functions (such as network and storage I/O and security isolation) from host CPUs, enabling higher performance and stronger isolation for EC2 instances; and the Graviton family of Arm‑based processors (Graviton and subsequent Graviton2/Graviton3 generations), which provide high performance per watt and are used in a wide range of EC2 instance types. Annapurna Labs’ technology has also contributed to AWS’s custom accelerators and specialized chips for inference and other workloads, along with supporting board and subsystem designs used across AWS server fleets. Operational model and customers: Following its acquisition, Annapurna Labs functions primarily as an in-house R&D and product engineering organization for Amazon/AWS rather than as a standalone commercial vendor selling chips directly to third parties. Its deliverables are integrated into AWS compute, storage, and networking products to improve throughput, reduce cost and power consumption, and enable new service capabilities. Through these integrations, AWS customers—enterprises, startups, and public-sector users—indirectly benefit from Annapurna Labs’ designs in the form of new instance types, specialized acceleration options, and platform-level features (for example, enhanced virtualization security provided through Nitro). Technology and integration focus: Annapurna Labs emphasizes hardware–software co-design, meaning the group develops chips and the low-level firmware and drivers required to expose their capabilities to higher-level cloud services. This includes designing secure firmware stacks, silicon-based root-of-trust features, and hardware acceleration engines for packet processing, storage offload, and cryptographic operations. The designs are intended to scale in rack- and data-center-level deployments; consequently, the organization also contributes to manufacturing qualification, supply-chain integration, and operational tooling required to bring new silicon into production across AWS’s global infrastructure. Strategic impact and role inside AWS: The creation and deployment of custom silicon and Nitro-class offload engines have been described in AWS materials as foundational to certain performance, security, and cost-efficiency improvements across Amazon’s cloud offerings. Annapurna Labs’ designs have enabled AWS to introduce distinct product capabilities—such as high-density, energy-efficient Arm-based compute instances and dedicated hardware paths for I/O and isolation—that differentiate AWS services in performance-per-dollar metrics and security posture. While Annapurna Labs itself is not a public-facing product company, its engineering outputs are a strategic enabler for AWS’s infrastructure roadmap and service portfolio. Publicly disclosed collaborations and communications: Details about Annapurna Labs and its projects have been shared in Amazon press releases, AWS blog posts, technical presentations, and regulatory filings since the acquisition. Those official channels describe the group’s role in developing the Nitro System and custom processors, as well as the subsequent use of that technology in EC2 instance families and other AWS services. As an entity, Annapurna Labs (U.S.) Inc. is a legal corporate unit tied to Amazon’s organizational and intellectual-property structure, responsible for managing U.S.-based engineering operations, compliance, and aspects of the commercial integration of its technologies within AWS. Limitations on external sales: Unlike independent semiconductor companies that market chips to a broad set of third-party OEMs, Annapurna Labs’ outputs are primarily intended for integration into Amazon/AWS infrastructure. As a result, most technical and product announcements emphasize the benefits delivered via AWS services rather than standalone Annapurna-branded products sold directly to external customers.

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