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Sr PCB Specialist, Annapurna Labs, Artificial Intelligence - Accelerator Hardware

ID: 6681

Type: Full-time

Category: Others

Company Name: Annapurna Labs (U.S.) Inc.

Location: USA, TX, Austin - Austin - United States

Salary: 159,200.00 - 215,300.00 USD annually

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Job Description

Acquired by Amazon in 2015, Annapurna Labs has grown from a stealth chip-design startup into the silicon engine behind AWS's most advanced AI infrastructure, designing custom silicon and software including AWS Trainium, Inferentia, Graviton, and Nitro. This is a rare opportunity to join that mission at the hardware foundation level, shaping the PCB technologies that carry next-generation AI accelerator chips from concept to global Data Center deployment, in a space where the playbook is still being written.

This role partners with leading PCB fabricators and material suppliers to pioneer next-generation technologies powering AI inference and training hardware, define development roadmaps, and qualify new processes and materials for reliable mass production. Working closely with Design Engineering and Signal Integrity teams, you will own the end-to-end PCB and PCBA technology roadmap across Annapurna's ML product line, building the strategy from the ground up, from early-stage R&D through mass-production readiness, while getting ahead of PCB, PCBA, and SMT requirements critical to large-scale AI accelerator platforms.

You will lead the strategic sourcing, quality, delivery, and commercial management of a global PCB supply base that doesn't fully exist yet, identifying, qualifying, and building supplier relationships capable of scaling with the explosive growth of AI infrastructure. This means selecting and pre-qualifying partners, securing capacity, and allocating market share across NPI and mass-production demands. Beyond supply, you will architect technical programs that advance PCB and PCBA technologies short- and long-term, drive R&D for next-generation materials, interconnect structures, and assembly processes, and set the standard for yield, reliability, and cycle time across all NPI quick-turn builds.

About the team
Annapurna Labs (our organization within AWS UC) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

Basic Qualifications

- B.S. or higher in Materials Science, Chemistry, Electrical Engineering, or related technical discipline or equivalent experience.
- 10+ overall years of experience across PCB and PCBA/SMT technologies, including at least 5 years leading large, global, cross-functional engineering or manufacturing technology organizations.
- Demonstrated mastery of PCB technology development including laminate systems, interconnect structures, HDI/multilayer stackups, fabrication processes, and reliability engineering.
- Proven experience managing and developing global PCB supply bases, including technology roadmaps, qualifications, quality programs, capacity strategies, and supplier performance management.

Preferred Qualifications

- Experience with high-reliability sectors (Automotive, Aerospace, Defense, Medical) and their demanding process control and reliability requirements is a strong advantage.
- Solid hands-on background in PCBA/SMT manufacturing, spanning solder materials, adhesives, underfill, thermal materials, stencil/reflow processes, DFM/DFT, SPC, failure analysis, and high-reliability assembly.
- Demonstrated ability to partner with Hardware, Signal Integrity, and Reliability Engineering teams across domestic and global locations to address complex design-to-build challenges.
- Proven executive-level leadership with clear communication, decisive problem-solving, and the ability to influence senior stakeholders in Engineering, Operations, and Supply organizations.
- A motivated, analytical, and creative mindset with a passion for developing cutting-edge technologies and driving global manufacturing capability.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.



USA, TX, Austin - 159,200.00 - 215,300.00 USD annually

Company Information

Company Name: Annapurna Labs (U.S.) Inc.

Company Website: https://annapurna-labs.com

Company Address: 10201 Torre Avenue, Cupertino, California 95014, USA

Annapurna Labs (U.S.) Inc. is the U.S. corporate entity of Annapurna Labs, an engineering organization originally founded as a semiconductor and systems-on-chip (SoC) design company that was acquired by Amazon in 2015 and subsequently integrated into Amazon Web Services (AWS). The business is organized around the design and delivery of custom silicon, hardware acceleration engines, and tightly integrated hardware–software platforms used to improve performance, security, and efficiency of cloud infrastructure. Annapurna Labs operates as an engineering and product-development organization whose principal output is purpose-built silicon, firmware, and supporting software stacks that are deployed inside AWS data centers and products. Company overview: Annapurna Labs began as a privately held microelectronics and chip-design startup with an emphasis on low-power, high-density compute and specialized accelerators. After acquisition by Amazon, the group continued as an internal Amazon/AWS engineering organization, focused on developing devices and subsystems that address bottlenecks in cloud servers and networking equipment. The organization is widely credited in official Amazon/AWS materials and public communications with designing and delivering several generations of custom AWS silicon and the enabling hardware subsystems that underpin notable AWS services and instance families. Core business activities: Annapurna Labs’ core activities center on end-to-end silicon and platform engineering: architecture, RTL and logic design, physical implementation, verification, firmware, board design, and the software integration required to bring custom chips into production at hyperscale. Key technical specializations include SoC and CPU core design, network and storage offload engines, hardware virtualization and security enclaves, high-speed interconnects, and low-level system software to exploit hardware capabilities. Instead of operating as a customer-facing chip vendor, the organization’s outputs are integrated into AWS infrastructure and services—its primary “customers” are AWS teams and the cloud customers that rely on AWS services. Main products and services: Public and official AWS communications associate Annapurna Labs with multiple internal silicon and platform programs that have been announced or described by Amazon. Notable outcomes attributable to the group include the AWS Nitro System, a collection of dedicated hardware and firmware components that offload virtualization functions (such as network and storage I/O and security isolation) from host CPUs, enabling higher performance and stronger isolation for EC2 instances; and the Graviton family of Arm‑based processors (Graviton and subsequent Graviton2/Graviton3 generations), which provide high performance per watt and are used in a wide range of EC2 instance types. Annapurna Labs’ technology has also contributed to AWS’s custom accelerators and specialized chips for inference and other workloads, along with supporting board and subsystem designs used across AWS server fleets. Operational model and customers: Following its acquisition, Annapurna Labs functions primarily as an in-house R&D and product engineering organization for Amazon/AWS rather than as a standalone commercial vendor selling chips directly to third parties. Its deliverables are integrated into AWS compute, storage, and networking products to improve throughput, reduce cost and power consumption, and enable new service capabilities. Through these integrations, AWS customers—enterprises, startups, and public-sector users—indirectly benefit from Annapurna Labs’ designs in the form of new instance types, specialized acceleration options, and platform-level features (for example, enhanced virtualization security provided through Nitro). Technology and integration focus: Annapurna Labs emphasizes hardware–software co-design, meaning the group develops chips and the low-level firmware and drivers required to expose their capabilities to higher-level cloud services. This includes designing secure firmware stacks, silicon-based root-of-trust features, and hardware acceleration engines for packet processing, storage offload, and cryptographic operations. The designs are intended to scale in rack- and data-center-level deployments; consequently, the organization also contributes to manufacturing qualification, supply-chain integration, and operational tooling required to bring new silicon into production across AWS’s global infrastructure. Strategic impact and role inside AWS: The creation and deployment of custom silicon and Nitro-class offload engines have been described in AWS materials as foundational to certain performance, security, and cost-efficiency improvements across Amazon’s cloud offerings. Annapurna Labs’ designs have enabled AWS to introduce distinct product capabilities—such as high-density, energy-efficient Arm-based compute instances and dedicated hardware paths for I/O and isolation—that differentiate AWS services in performance-per-dollar metrics and security posture. While Annapurna Labs itself is not a public-facing product company, its engineering outputs are a strategic enabler for AWS’s infrastructure roadmap and service portfolio. Publicly disclosed collaborations and communications: Details about Annapurna Labs and its projects have been shared in Amazon press releases, AWS blog posts, technical presentations, and regulatory filings since the acquisition. Those official channels describe the group’s role in developing the Nitro System and custom processors, as well as the subsequent use of that technology in EC2 instance families and other AWS services. As an entity, Annapurna Labs (U.S.) Inc. is a legal corporate unit tied to Amazon’s organizational and intellectual-property structure, responsible for managing U.S.-based engineering operations, compliance, and aspects of the commercial integration of its technologies within AWS. Limitations on external sales: Unlike independent semiconductor companies that market chips to a broad set of third-party OEMs, Annapurna Labs’ outputs are primarily intended for integration into Amazon/AWS infrastructure. As a result, most technical and product announcements emphasize the benefits delivered via AWS services rather than standalone Annapurna-branded products sold directly to external customers.
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